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Layout Guidelines |
Gold Bumps |
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1 |
Bump Height Average | 18 µm & 25 µm std. (Capability: 2-50 µm) |
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2 |
Bump Height Uniformity | ±5% (in die); ±10% (in wfr); ±15% (wfr to wfr) |
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3 |
Bump Pitch | 50 µm Minimum (bump size dependence) |
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4 |
Bump Spacing | 18 µm Minimum (bump height dependence) |
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5 |
Bump to Pass. Overlap | 7 µm Per Side Minimum |
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6 |
Edge of Bump to Al | 7 µm Per Side Minimum |
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7 |
Passivation Opening | 16 µm Minimum |
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8 |
Passivation Angle of Slope | > 60 Degrees |
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9 |
Passivation Type | Nitride, OxyNitride, Polyimide |
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10 |
Wafer Edge Exclusion | 3mm |
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11 |
Bump Mask Layout and Procurement | TLMI In-house Capability: Requires GDSII, Stepping Distance, Wafer Map |
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Bump Specifications |
Gold Bumps |
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1 |
Bump Material | 99.9+% pure Gold |
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2 |
Bumping Method | Electroplating |
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3 |
UBM Material | WTi 90/10 |
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4 |
UBM Deposition Method | Sputtering |
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5 |
Bump Shear Strength | > 5.6g/mil2 |
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6 |
Bump Hardness | 40 – 70 Vickers (Annealed) |