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Solder Bumping

Layout Guidelines Solder Bumps 1 Standard Bump Height 100 µm (Available: 25µm – 150µm) 2 Bump Height Uniformity ±5% (in die); ±15% (in wfr); ±20% (wfr to wfr) 3 Bump Pitch 150 µm Standard ( Fine Pitch Available = 100 µm) Bump Height Dependence 4 Bump Spacing 75 µm Std. (Bump Size Dependence) 5 Bump to Pass....